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Business

Semiconductor / Display

 

Solving Process Challenges in
Advanced Semiconductor Manufacturing

 

Discover How We Solve Your Challenges.

 

In front-end semiconductor processes, wafers can suffer plasma-induced damage due to direct plasma exposure.

EN2CORE Technology’s Remote Plasma Source (RPS) delivers electrically neutral reactive species (radicals),
enabling processing without direct plasma contact with the wafer.

This approach enables damage-free, high-precision processing—ideal for advanced 3D structures in next-generation devices.

Watch how it works

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WORLD BEST PLASMA TECHNOLOGY (for semiconductor)

Redefining Plasma Processing Capability

EN2CORE Technology’s RPS is engineered specifically for front-end semiconductor processing.
It delivers optimized performance across a wide range of advanced applications, including PECVD, ALD, ALE, native oxide removal, surface treatment, metal etching, hard mask stripping, ashing, and chamber cleaning.
By overcoming the limitations of direct plasma exposure, the remote plasma approach ensures precise process control and superior performance.

RPS Product Lineup

EN2RA-RPS

EN2RA-RPS

BLUE-F

BLUE-F

PRO-RPS

PRO-RPS

RPS field of application

plasma

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Accelerate Your Innovation with Our Proven Plasma Expertise

With EN2CORE Technology’s Remote Plasma Source (RPS), backed by robust IP, specialized know-how, and qualification through rigorous fab testing, you can reduce development costs, accelerate timelines, and confidently tackle your toughest plasma processing challenges with a trusted partner.

EN2CORE Technology — The Leading Solution for Remote Plasma Processing

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