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RPS for Chamber Cleaning

Chamber Cleaning RPS

EN2CORE Technology’s chamber cleaning RPS, designed for reliable NF₃-based chamber cleaning, maximizes residue removal efficiency through stable generation of reactive species.
In addition, its energy-efficient design significantly reduces power consumption, supporting ESG management goals.
It also enables stable operation with semiconductor equipment and allows for easy system integration.

EN2RA™ -RPS

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    High Cleaning Efficiency

    Up to 20% higher SiO₂ etch rate for faster, more effective residue removal.

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    Power Efficiency

    Delivers performance with up to 40% less power reducing energy use and cost.

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    Compact & Lightweight Design

    Smaller size and weight for easy tool integration.

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    Wide NF₃ Flow Range Support

    Supports NF₃ flow rates from 2 to 8 slm, enabling compatibility with various chamber cleaning conditions.

Chamber Cleaning RPS Specifications

Next-Generation Cleaning RPS, Compact and Power-Efficient BLUE-F is EN2CORE Technology’s next-generation chamber cleaning Remote Plasma Source (RPS), designed to replace legacy systems with a compact, energy-efficient, and cost-effective solution.
Developed for NF₃ plasma cleaning, BLUE-F reduces volume by 22%, footprint by 19%, and weight by 25% compared to leading competitor models—without compromising performance.

EN2RA™ -RPS

Max. Power
6kW
Ignition Gas
0.5 to 5 Torr, 100% Ar
Gas Compatibility

Ar, NF3

Gas Flow Rate
Up to 2 slm / 8 slm
Process
Chamber Cleaning
  • Over 95% NF₃ dissociation
  • Wide Discharge Window
  • Compact and lightweight design
    (14 kg, 380 mm × 240 mm × 260 mm [D×W×H])

Let’s Solve Your Process Challenges

From reducing particles and power consumption to improving chamber uptime,
EN2CORE Technology’s Cleaning RPS is built to meet your toughest fab cleaning demands
efficiently, reliably, and precisely.

Talk to an expert

Talk to an expert