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RPS for Process

Process RPS Lineup

Designed for advanced semiconductor processes such as ALD and ALE, EN2CORE Technology’s Process RPS is a next-generation Remote Plasma Source that directly participates in wafer processing.
It delivers high-efficiency plasma generation with minimal particle contamination, offering superior ignition performance, wide process compatibility, and excellent operational stability.

EN2RA™ -RPS

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    Compact Effective Plasma Area

    Reduces particle generation and minimizes loss of active species

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    High-Purity Ceramic Discharge Tube

    Reduces contamination and increases lifespan

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    Simplified Tube Structure

    Easier maintenance and reduced downtime

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    Wide Gas Compatibility

    Supports a wide range of processes and chemistries

Process RPS Specifications

EN2RA-RPS™ is EN2CORE Technology’s flagship product, designed to meet the demands of cutting-edge semiconductor processes.
It delivers precise, damage-free generation of active species with ultra-low particle characteristics and has been successfully validated in front-end applications across multiple semiconductor manufacturing sites.
Optimized for ALD, ALE, and surface pre-treatment processes, it ensures high performance and process reliability.

EN2RA™ -RPS

Max. Power
6kW
Ignition Gas

0.5 to 10 Torr, 100% H2, O2, N2 or Ar

Gas Compatibility

NF3, O2, N2, H2, CxFy, NH3

Process

ALD, NOR, Hard Mask Strip, ALE(ALR), Pre-treatment, H2 Annealing

  • Wide Discharge Window High Plasma Density
  • Low Plasma Loss, Less Particle Effect
  • Power Accuracy <± 1%
  • Provide Sub Gas solution (Optional)
  • Uses Process Gas Plasma ignition (H2, O2, N2)

PRO-RPS offers broad compatibility across gas chemistries and pressure ranges, along with exceptional radical generation efficiency.
It is suitable for precision control processes using low power.
Recognized with the IR52 Jang Young Shil Award for technological excellence, PRO-RPS is already in use in volume manufacturing lines for DRAM and logic devices.

PRO-RPS

Max. Power
4.5kW
Ignition Gas
0.5 to 5 Torr, 100% Ar
Gas Compatibility

NF3, O2, N2, H2, CxFy, NH3

Process

ALE(ALR), NOR, Pre-treatment, H2 Annealing Process

  • Low Power Plasma Control (Min 180W)
  • High Plasma Density, Low Plasma Loss, Less Particle Effect
  • Power Accuracy <± 1%
  • Provide Sub Gas solution (Optional)

PRO-RPS (QUARTZ) is a specialized model of the PRO-RPS platform optimized for plasma processes that primarily utilize oxygen radicals (O species).
By applying a quartz-based discharge structure, it minimizes surface losses of O radicals and ensures stable plasma operation with excellent thermal durability.
It is well-suited for sensitive processes such as thin films and dielectrics.

PRO-RPS (QUARTZ)

Max. Power
4.5kW / 6kW
Ignition Gas

0.5 to 2 Torr, 100% O2 or 90% O2, 10% N2

Gas Compatibility

O2, N2

Gas flow rate

Up to 10slm (9:1 O2 : N2)

Process

Ashing, PR Strip

  • Quartz Plasma Tube
  • Wide Process Gas Ignition Window
  • High Density for Oxygen Species

Let’s Solve Your Process Challenges

Whether you're optimizing tool performance, enhancing process uniformity, or exploring new device architectures,
EN2CORE Technology is ready to support with plasma solutions built for innovation.

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